Author/Creator: Abu Bakar, Maria - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Abu Bakar, Maria

1. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition. Issue 2 (1st April 2019)

Authors:: Wan Yusoff, Wan Yusmawati; Ismail, Norliza; Safee, Nur Shafiqa; Ismail, Ariffin; Jalar, Azman; Abu Bakar, Maria
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 102
Record Type:: Journal Article
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2. Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition. Issue 2 (2nd April 2019)

Authors:: Wan Yusoff, Wan Yusmawati; Ismail, Norliza; Safee, Nur Shafiqa; Ismail, Ariffin; Jalar, Azman; Abu Bakar, Maria
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 2(2019)
Page Start:: 102
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

3. Effect of alloy particle size and stencil aperture shape on solder printing quality. Issue 2 (5th May 2022)

Authors:: Mohamed Sunar, Mohamad Solehin; Abu Bakar, Maria; Jalar, Azman; Ramli, Mohamad Riduwan; Che Ani, Fakhrozi
Journal:: Microelectronics international
Issue:: Volume 39:Issue 2(2022)
Page Start:: 81
Record Type:: Journal Article
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4. Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu. Issue 3 (11th February 2020)

Authors:: Ismail, Norliza; Jalar, Azman; Abu Bakar, Maria; Ismail, Roslina; Saedi Ibrahim, Najib
Journal:: Soldering & surface mount technology
Issue:: Volume 32:Issue 3(2020)
Page Start:: 157
Record Type:: Journal Article
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5. Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu. Issue 3 (7th February 2020)

Authors:: Ismail, Norliza; Jalar, Azman; Abu Bakar, Maria; Ismail, Roslina; Saedi Ibrahim, Najib
Journal:: Soldering & surface mount technology
Issue:: Volume 32:Issue 3(2020)
Page Start:: 157
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

6. Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition. Issue 1 (30th June 2020)

Authors:: Ismail, Norliza; Jalar, Azman; Abu Bakar, Maria; Safee, Nur Shafiqa; Wan Yusoff, Wan Yusmawati; Ismail, Ariffin
Journal:: Soldering & surface mount technology
Issue:: Volume 33:Issue 1(2021)
Page Start:: 47
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

7. Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition. Issue 1 (8th July 2020)

Authors:: Ismail, Norliza; Jalar, Azman; Abu Bakar, Maria; Safee, Nur Shafiqa; Wan Yusoff, Wan Yusmawati; Ismail, Ariffin
Journal:: Soldering & surface mount technology
Issue:: Volume 33:Issue 1(2021)
Page Start:: 47
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗