1. Structural and mechanical analyses of soldering materials containing Pb, Sn, Ag, Cu, Bi and Zn. (2021) Authors: Mazullah, ; Khan, Maaz; Ali, Ghafar; Khan, Muhammad Naeem; Zaib, Aurang; Abbas, Shafqat Journal: Materials today Issue: Volume 47:Suppement(2021) Page Start: S83 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗