Binary polymer blend of ArPTU/PI with advanced comprehensive dielectric properties and ultra‐high thermally stability. Issue 39 (15th May 2021)

• Record Type: Journal Article
• Authors: Ahmad, Aftab; Tong, Hui; Fan, Tao; Xu, Ju
• Is Part Of: Journal of applied polymer science. Volume 138:Issue 39(2021)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2021-05-15
• Subjects: blends -- dielectric properties -- thermal properties; Polymers -- Periodicals; Polymerization -- Periodicals; 668.9
• DOI: 10.1002/app.50997
• Languages: English
• ISSNs: 0021-8995

Abstract

Abstract: Flexible high‐temperature polymeric dielectrics with advanced dielectric properties are urgently demanded in various applications. In this work, series of polymer blend films were prepared from aromatic polythiourea (ArPTU) and polyimide (PI). The experimental results revealed that the blend films were properly engineered to achieve higher breakdown strength, greater dielectric constant, and larger energy density than pure PI film. For instance, the optimum property was obtained from the blend film with 10 wt% ArPTU, exhibiting prominent dielectric properties ( K = 4.52, E b = 443 MV/m), enhanced energy density (4.00 J/cm 3 ) as well as excellent heat resistance ( T g = 419°C). In addition, stable dielectric properties at broad temperature range from −50 to 250°C were also acquired. It is deduced that the good compatibility from ArPTU and PI with similar polarity are responsible for the improved properties. The superior comprehensive properties which combine the advantages of ArPTU and PI suggest the potential applications of ArPTU/PI blend film in high‐temperature dielectric areas. Abstract : High performance polymer dielectrics areurgently demanded for high‐temperature film capacitors operated in hostileenvironments in various applications. Herein, a series of polymer blend film preparedfrom polyimide (PI) and aromatic polythiourea(ArPTU) exhibiting brilliant dielectric properties, outstanding heatresistance and notable thermal stability of dielectric properties were obtainedand investigated. It is deduced that the enhanced comprehensive properties areattributed to the good compatibility between the "organic filler" and the polymermatrix.