Controlled Distributed Ti3C2Tx Hollow Microspheres on Thermally Conductive Polyimide Composite Films for Excellent Electromagnetic Interference Shielding. Issue 16 (9th March 2023)

• Record Type: Journal Article
• Authors: Zhang, Yali; Ruan, Kunpeng; Zhou, Kun; Gu, Junwei
• Is Part Of: Advanced materials. Volume 35:Issue 16(2023)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2023-03-09
• Subjects: electromagnetic interference shielding -- polymethyl methacrylate microspheres templates -- thermal conductivity -- Ti 3C 2Tx hollow microspheres; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.202211642
• Languages: English
• ISSNs: 0935-9648

Abstract

Abstract: Flexible multifunctional polymer‐based electromagnetic interference (EMI) shielding composite films have important applications in the fields of 5G communication technology, wearable electronic devices, and artificial intelligence. Based on the design of a porous/multilayered structure and using polyimide (PI) as the matrix and polymethyl methacrylate (PMMA) microspheres as the template, flexible (Fe3 O4 /PI)–Ti3 C2 T x –(Fe3 O4 /PI) composite films with controllable pore sizes and distribution of Ti3 C2 T x hollow microspheres are successfully prepared by sacrificial template method. Owing to the porous/multilayered structure, when the pore size of the Ti3 C2 T x hollow microspheres is 10 µm and the mass ratio of PMMA/Ti3 C2 T x is 2:1, the (Fe3 O4 /PI)–Ti3 C2 T x –(Fe3 O4 /PI) composite film has the most excellent EMI shielding performance, with EMI shielding effectiveness (EMI SE) of 85 dB. It is further verified by finite element simulation that the composite film has an excellent shielding effect on electromagnetic waves. In addition, the composite film has good thermal conductivity (thermal conductivity coefficient of 3.49 W (m·K) −1 ) and mechanical properties (tensile strength of 65.3 MPa). This flexible (Fe3 O4 /PI)–Ti3 C2 T x –(Fe3 O4 /PI) composite film with excellent EMI shielding performance, thermal conductivity, and mechanical properties has demonstrated great potential for applications in EMI shielding protection for high‐power, portable, and wearable flexible electronic devices. Abstract : Flexible (Fe3 O4 /polyimide (PI))–Ti3 C2 T x –(Fe3 O4 /PI) composite films with controllable pore sizes and distribution of Ti3 C2 T x hollow microspheres show electromagnetic interference shielding effectiveness of 85 dB owing to the magnetic loss in Fe3 O4 /PI fiber film, multiple reflection, ohmic loss, and polarization loss in Ti3 C2 T x hollow microspheres.