Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys. (14th December 2020)

• Record Type: Journal Article
• Authors: Li, Shuai; Wang, Xingxing; Liu, Zhongying; Mao, Feng; Jiu, Yongtao; Luo, Jingyi; Shangguan, Linjian; Jin, Xiangjie; Wu, Gang; Zhang, Shuye; He, Peng; Long, Weimin
• Other Names: Sun Fengqiang Academic Editor.
• Is Part Of: Journal of nanomaterials. Volume 2020(2020)
• Publication Date: 2020-12-14
• Subjects: Nanostructured materials -- Periodicals; Nanotechnology -- Periodicals; Nanomatériaux; Nanostructured materials; Nanotechnology; Nanostructures; Nanotechnology; Periodicals; Fulltext; Internet Resources; Periodicals; 620.115
• DOI: 10.1155/2020/8843166
• Languages: English
• ISSNs: 1687-4110

Abstract

Abstract : With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.