Laser powder bed fusion of a Cu-Ni-Al alloy using the compositional grading approach. (1st July 2023)

• Record Type: Journal Article
• Authors: Wei, Siyuan; Zhao, Yakai; Li, Shi-Hao; Chen, Shilin; Lau, Kwang Boon; Soh, Verner; Lee, Jing Jun; Zhang, Baicheng; Tan, Cheng Cheh; Wang, Pei; Ramamurty, Upadrasta
• Is Part Of: Scripta materialia. Number 231(2023)
• Publication Date: 2023-07-01
• Subjects: Laser powder bed fusion -- Copper alloys -- Compositional graded alloy -- Mechanical properties -- Electrical resistivity/conductivity; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2023.115441
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: Using a modified laser powder bed fusion (LPBF) technique, a compositionally graded Cu-Ni alloy was fabricated. Through microstructural and mechanical characterization on the samples extracted from it, the addition of 7.6 wt.% Ni to Cu is identified as the minimum required for obtaining a crack-free and nearly-fully-dense coupons using LPBF. Subsequently, 3 wt.% Al was added to the Cu-7.6 wt.% alloy to deplete the solute Ni atoms from the matrix through the precipitation of Ni3 Al upon aging of the LPBF Cu-Ni-Al alloy, which simultaneously enhances the strength and electrical conductance of the alloy. Through this example, we demonstrate the potential of high-throughput screening of alloys suitable for LPBF through the fabrication of the compositionally graded alloys and subsequent alloy design for optimum property combinations. Graphical abstract: Image, graphical abstract