A self-healing polyvinyl alcohol-based composite with high thermal conductivity and excellent mechanical properties. (April 2023)

• Record Type: Journal Article
• Authors: Wei, Qungui; Yang, Dan
• Is Part Of: Composites communications. Volume 39(2023)
• Publication Date: 2023-04
• Subjects: Polyvinyl alcohol -- Borate ester -- Thermal conductivity -- Self-healing
• DOI: 10.1016/j.coco.2023.101561
• Languages: English
• ISSNs: 2452-2139

Abstract

Abstract: Conventional thermally conductive polymeric composites are prone to mechanical failures when deployed in dynamic environments, which results in loss of functionality and reduced service life. Herein, self-healing thermally conductive composites are fabricated by dispersing polydopamine (PDA) modified boron nitride (BN) and borate ions into polyvinyl alcohol (PVA) matrix. Due to the decreased thermal interface resistance and formation of thermal conduction channels, the 13 vol% BN-PDA/PVA composite endows an enhancement of 562% in thermal conductivity (1.007 W/mK) comparing with pure PVA (0.152 W/mK). In addition, the hydrogen bonds between BN-PDA and PVA chains and the borate bonds in dynamic borax/PVA networks impart a high self-healing efficiency of more than 80% and excellent mechanical properties in BN-PDA/PVA composites. This study provides a straightforward method for the preparation of thermal interface materials with fast recovery and long service life for next generation electronic packaging applications. Graphical abstract: Image 1 Highlights: Self-healing BN-PDA/PVA composites with high thermal conductivity and excellent mechanical properties are fabricated. The highest λ reaches to 1.007 W/mK by 13 vol% BN-PDA/PVA composite, an enhancement of 562% compared with pure PVA. The hydrogen bonds and borate bonds in dynamic networks impart the PVA composite a self-healing efficiency more than 80%. The BN-PDA/PVA composite demonstrates an elongation at break and tensile stress of 685.8% and 72.9 KPa, respectively. This study provides a method for the preparation of thermal interface materials with fast recovery and long service life.