Copper alumina reinforced poly(aniline-co-indole) nanocomposites for optoelectronic devices. Issue 8 (24th May 2023)

• Record Type: Journal Article
• Authors: Sankar, S.; Furhan, ; George, Ajith; Ramesan, M. T.
• Is Part Of: Materials science and technology. Volume 39:Issue 8(2023)
• Page Start: 941
• Page End: 953
• Publication Date: 2023-05-24
• Subjects: Poly(aniline-co-indole) -- copper alumina -- nanocomposites -- optical properties -- thermal -- temperature-dependent conductivity -- dielectric parameters -- DC conductivity modelling; Materials science -- Periodicals; Microstructure -- Periodicals; Metallurgy -- Periodicals; 620.1105
• DOI: 10.1080/02670836.2022.2152924
• Languages: English
• ISSNs: 0267-0836

Abstract

ABSTRACT: Copper alumina (Cu-Al2 O3 ) reinforced poly(aniline- co -indole) (PANI- co -PIN) nanocomposites were prepared and characterised by UV-vis spectroscopy, FE-SEM and DSC. The bandgap energy decreased with the addition of Cu-Al2 O3 to PANI- co -PIN. The FE-SEM confirms the uniform dispersion of nanoparticles in the copolymer. The DSC showed a shift in glass transition temperatures to higher regions with Cu-Al2 O3 concentrations. The frequency-temperature-dependent dielectric parameters and electrical conductivity of nanocomposites were investigated. Activation energy calculated from Arrhenius equation decreases with increasing frequency. The real and imaginary part of electric modulus implies the thermally activated dielectric relaxations. The decreasing radius of semicircles in Nyquist plot with increasing temperatures indicates the existence of thermally activated conduction mechanisms. Different theoretical models were used to predict the DC conductivity mechanism in copolymer nanocomposites.