Anchoring modified polystyrene to boron nitride nanosheets as highly thermal conductive composites for heat dissipation. Issue 3 (22nd January 2022)

• Record Type: Journal Article
• Authors: Han, Weifang; Chu, Xiaohan; Li, Yongwei; Xu, Ziping; Li, Wei; Fu, Peng; Li, Yuchao; Zhang, Xinwei; Jia, Zhengfeng; Zhang, Xiangdong
• Is Part Of: Polymer composites. Volume 43:Issue 3(2022)
• Page Start: 1844
• Page End: 1851
• Publication Date: 2022-01-22
• Subjects: boron nitride -- interfacial compatibility -- polystyrene‐based composite -- surface modification -- thermal conductivity; Polymeric composites -- Periodicals; 620.192
• DOI: 10.1002/pc.26502
• Languages: English
• ISSNs: 0272-8397

Abstract

Abstract: Enhancing the heat dissipation capacity of polymer‐based composites requires effectively improving the compatibility of filler in a polymer matrix. Herein, hydroxylated boron nitride (BN‐OH) and modified polystyrene (mPS) are combined to achieve a high thermal conductive BN‐OH@mPS composite by using a facile in‐situ polymerization. Due to the strong interface interaction between BN‐OH and mPS, the proposed BN‐OH@mPS composite can have high thermal conductivity (TC). Specifically, the TC of the composite containing 10 wt% BN‐OH can reach 1.231 W/mK, which is 142% higher than that of BN/PS manufactured by a traditional method. Additionally, such a special structure brings a delayed decomposition process of the composite, making it possess high thermal stability. Overall, this serves as a universal route for developing thermal conductive non‐polar polymer/inorganic filler composites. Abstract : The effects of boron nitride (BN) on the heat transfer performance of polystyrene (PS) are investigated. The as‐prepared core‐shell structured hydroxylated BN@modified PS (BN‐OH@mPS) composites with high thermal conductivity have a great application potential in the heat dissipation of electronic devices.