Dynamic Leakage‐Free Liquid Metals. (30th December 2022)

• Record Type: Journal Article
• Authors: Lu, Yongyu; Yu, Dehai; Dong, Haoxuan; Chen, Sen; Zhou, He; Wang, Lichen; Deng, Zhongshan; He, Zhizhu; Liu, Jing
• Is Part Of: Advanced functional materials. Volume 33:Number 11(2023)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2022-12-30
• Subjects: dynamically immobilized materials -- leakage free -- liquid metals -- permanent magnetic particles -- robust volumetric porous structures; Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adfm.202210961
• Languages: English
• ISSNs: 1616-301X

Abstract

Abstract: Leakage is a significant issue that prevents the widespread application of liquid metals (LMs) and an effective solution has not yet been developed. One potential solution is to use the high surface tension of LMs to encapsulate them in a porous material. However, it is challenging as it is difficult to infuse LMs into tiny pores. This study proposes a bottom‐up strategy where LMs are doped with NdFeB@Ag particles, which are then magnetized to form a tight porous structure. This structure is robust and resistant to collapse under mechanical deformation. Therefore, LMs can be reliably immobilized within the pores between the particles, and a dynamic leakage‐free state is achieved. The encapsulated LMs demonstrate excellent properties including a large latent heat of 153.46 J cm −3, high thermal conductivity of 35.62 W m −1 K −1, and enhanced electrical conductivity of 69.61%, which efficiently extends their functional scope and potential value. Abstract : Leakage is a significant challenge that prevents the diverse application of liquid metals (LMs). In this study, dynamic leakage‐free encapsulation of LMs is achieved using a porous structure formed of permanent magnetic particles and the LMs with high surface tension. The resulting materials have outstanding thermal and electrical properties, and effectively extend the functional scope and potential value of LMs in applications such as thermal management and 3D electronics.