Evolution of intragranular stresses and dislocation densities during cyclic deformation of polycrystalline copper. (1st August 2015)

• Record Type: Journal Article
• Authors: Jiang, Jun; Benjamin Britton, T.; Wilkinson, Angus J.
• Is Part Of: Acta materialia. Volume 94(2015)
• Page Start: 193
• Page End: 204
• Publication Date: 2015-08-01
• Subjects: Fatigue deformation -- Geometrically necessary dislocations (GNDs) -- Intragranular stress -- High resolution electron backscattering diffraction (HR-EBSD); Materials -- Periodicals; Materials science -- Periodicals; Materials -- Mechanical properties -- Periodicals; Metallurgy -- Periodicals; Chemistry, Inorganic -- Periodicals; 620.112
• DOI: 10.1016/j.actamat.2015.04.031
• Languages: English
• ISSNs: 1359-6454

Abstract

Abstract: We have used the cross-correlation based high resolution electron backscattering diffraction (HR-EBSD) technique to evaluate at high spatial resolution the spatial patterning of the type III intragranular residual stresses and geometrically necessary dislocation (GND) density within polycrystalline Cu after cyclic deformation. Oxygen free high conductivity (OFHC) polycrystalline copper samples were cyclically deformed under stress-control at a load ratio of 0.1 and EBSD measurements were made at points throughout the early stages of fatigue when strain amplitudes and cyclic creep rates are changing most significantly, namely at 0 cycles, 2 cycles, 200 cycles and 2000 cycles. Statistical analysis is presented showing that moderate correlations exist between stored GND density, residual intragranular stress and distance from the nearest grain boundaries and/or triple junctions.