Cite
HARVARD Citation
Cemin, F. et al. (2017). Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films. Acta materialia. pp. 120-130. [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Cemin, F. et al. (2017). Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films. Acta materialia. pp. 120-130. [Online].