Cite
HARVARD Citation
Guan, X. et al. (2023). Distribution optimization of thermal through-silicon via for 3D chip based on thermal-mechanic coupling. Microelectronics journal. p. . [Online].
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Guan, X. et al. (2023). Distribution optimization of thermal through-silicon via for 3D chip based on thermal-mechanic coupling. Microelectronics journal. p. . [Online].