Interfacial microstructure evolution and mechanical properties of AlCoCrFeNi2.1 alloy by multilayer additive hot compression bonding. (May 2023)
- Record Type:
- Journal Article
- Title:
- Interfacial microstructure evolution and mechanical properties of AlCoCrFeNi2.1 alloy by multilayer additive hot compression bonding. (May 2023)
- Main Title:
- Interfacial microstructure evolution and mechanical properties of AlCoCrFeNi2.1 alloy by multilayer additive hot compression bonding
- Authors:
- Zhang, Yubo
Ding, Chenghao
Liu, Jiajing
Lu, Yiping
Li, Tingju - Abstract:
- Abstract: Multilayer additive hot-compression bonding (MAHCB) is an efficient manufacturing method for obtaining a large alloy with a uniform composition and microstructure. In this work, the method was applied to an AlCoCrFeNi2.1 eutectic alloy for the first time. The results show that the bonding temperature significantly affects the interface microstructure, improving dynamic recrystallization (DRX) and interface grain boundary migration (GBM), as well as reducing defects at the interface. Optimal bonding was obtained at a bonding temperature of 1250 °C. The interfacial Vickers hardness reaches 317 HV, and the tensile‒shear strength reaches 894 MPa, which are 9.3% and 16.5% improved, respectively, compared with the as-cast sample. The interface microstructure and fracture morphology are very close to those of the as-cast state. The combination of temperature and strain promote the interfacial bonding process, which mainly include DRX in the FCC phases, element diffusion between the FCC and B2 phases, and transformation of harmful B2–B2 interfaces into those of FCC-B2 type. Highlights: The MAHCB process was used to build a larger AlCoCrFeNi2.1 EHEA ingot in this study. The microstructure scarcely changed after successful MAHCB, very close to the as-cast condition. The interfacial Vickers hardness and the tensile‒shear strength are even 9.3% and 16.5% improved, respectively, compared with the as-cast sample.
- Is Part Of:
- Intermetallics. Volume 156(2023)
- Journal:
- Intermetallics
- Issue:
- Volume 156(2023)
- Issue Display:
- Volume 156, Issue 2023 (2023)
- Year:
- 2023
- Volume:
- 156
- Issue:
- 2023
- Issue Sort Value:
- 2023-0156-2023-0000
- Page Start:
- Page End:
- Publication Date:
- 2023-05
- Subjects:
- Multilayer additive hot compression bonding -- Eutectic high-entropy alloy -- Interfacial microstructure evolution -- Mechanical property
Intermetallic compounds -- Metallography -- Periodicals
Metallic glasses -- Periodicals
Composés intermétalliques -- Métallographie -- Périodiques
669.94 - Journal URLs:
- http://www.sciencedirect.com/science/journal/09669795 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.intermet.2023.107867 ↗
- Languages:
- English
- ISSNs:
- 0966-9795
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 4534.562000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 26081.xml