MXene fillers and silver flakes filled epoxy resin for new hybrid conductive adhesives. Issue 8 (15th April 2023)

• Record Type: Journal Article
• Authors: Guo, ZhiJin; Lu, WenBin; Zhang, Yan; Zhou, JianPing; Sun, DaQian
• Is Part Of: Ceramics international. Volume 49:Issue 8(2023)
• Page Start: 12054
• Page End: 12060
• Publication Date: 2023-04-15
• Subjects: MXene -- Silver-coated copper -- Electrical conductive adhesives -- ECAs; Ceramics -- Periodicals; Céramique industrielle -- Périodiques; Ceramics; Periodicals; Electronic journals; 666
• DOI: 10.1016/j.ceramint.2022.12.055
• Languages: English
• ISSNs: 0272-8842

Abstract

Abstract: The addition of V2 CTx two-dimensional materials as auxiliary fillers in conductive adhesives can increase the contact area between conductive particles inside the matrix effectively reducing the resistivity of epoxy resin conductive adhesives. The V2 CTx /Ag/rGO/MWCNTs fillers inside the epoxy resin will connect more Ag-clad Cu particles to form a conductive pathway, but its excessive content will be aggregated inside and thus increase the resistivity of the conductive adhesive. The volume resistivity of ECAs increases from 4.4 × 10 −6 Ω m to 1.15 × 10 −5 Ω m when the V2 CTx /Ag/rGO/MWCNTs content of 0.1% increases to 0.34%. The Ag-clad Cu particles are interconnected inside the epoxy resin to form an electron transfer network. Inside the epoxy resin substrate Ag-clad Cu particles and V2 CTx /Ag/rGO/MWCNTs interconnects to form a larger conductive network, so that the conductive adhesive shows good conductive properties.