Thermal study on novel spokes fin for high power LED. (27th February 2023)

• Record Type: Journal Article
• Authors: Nandanwar, Tanmay; Jani, Jash; Rammohan, A
• Is Part Of: Engineering research express. Volume 5:Number 1(2023)
• Publication Date: 2023-02-27
• Subjects: LED lights -- junction temperature -- radiation -- spokes fin -- heatsink; Engineering -- Periodicals; 620.005
• DOI: 10.1088/2631-8695/acbd11
• Languages: English
• ISSNs: 2631-8695

Abstract

Abstract: High Power LED (HPLED) lights are popular today in industrial, residential, and consumer applications. In this work, under natural cooling considerations, on a commercial (size 17.85 × 17.85 × 3 mm) heatsink base, a novel spokes fin model was introduced and the temperature has been investigated and compared with rectangular and circular fin models. Using commercial FEA tool, the effect of heat transfer has been explored for a single and six HPLED arrays integrated on the top of the heat sink base and for different fin lengths, about 60 mm, 70 mm and 80 mm and junction temperatures 130 °C, 110 °C, 90 °C, 70 °C and 50 °C. The results revealed that the novel spokes fin is effective at about 4.72% (6 °C) on the upper part of the fins and 5.87% (13 °C) on the lower part of the fins. The heat dissipation from the HPLED junction to the atmosphere is effective using novel spokes compared to rectangular fins for both single and six HPLED array configurations. At the same time, the rectangular fin is effective in dissipating the heat for a single HPLED operation compared to the circular fin about 2.85% on the upper fins, 3.66% on the lower fins and has an equal dissipation effect while used for six HPLED array configurations. During the simulation, the mesh independence test is conducted and the radiation effect is also considered.