Interfacial reaction and microstructure evolution of nanoparticle-added Al/Cu welded interface under direct current treatment. (March 2023)

• Record Type: Journal Article
• Authors: Li, Yan; Huang, Jiankang; Yang, Nan; Fan, Ding; Yu, Xiaoquan; Zhuang, Huan
• Is Part Of: Materials today communications. Volume 34(2023)
• Publication Date: 2023-03
• Subjects: Conductivity -- DC electric field -- Nanoparticles -- Intermetallic compound -- Plasma arc welding; Materials science -- Periodicals; 620.11
• DOI: 10.1016/j.mtcomm.2023.105327
• Languages: English
• ISSNs: 2352-4928

Abstract

Abstract: The 1060 pure aluminum was joined to T2 copper in the lap configuration by plasma arc welding with adding nanoparticles, and the welded joint was treated by direct current (DC). The DC current loading experiment was carried out on the welded joint, the change of the interface structure of the joint under the DC electric field was studied, and the evolution mechanism of the interface intermetallic compound (IMC) under the current loading was analyzed. The results found that in the DC electric field, the electron wind, temperature gradient and concentration gradient during the electromigration process promoted the migration of Al and Cu atoms, and the increase of the joint temperature during the welding process promoted the atomic reaction. With the prolongation of the current loading time, the thickness of the intermetallic compound layer at the interface of the joint increases to different degrees. At the same time, the nanoparticles are also aggregated into large-sized grains under the action of the electric field, which are distributed in the Al-Cu eutectic zone at the front of the compound. Graphical Abstract: ga1 Highlights: The 1060 pure aluminum was joined to T2 copper in the lap configuration by plasma arc welding with adding nanoparticles. The effect of the self-generated electro-thermal coupling field under the action of electric current on the microstructure of nanoparticle-added Al/Cu lap joints was investigated. The diffusion law of the elements in the joint during the electromigration process and the evolution of the intermetallic compound layer at the interface are analyzed.