Bulk Bi2Te3-based bendable thermoelectric device with highly elastic Cu-Be alloy foils. (March 2023)

• Record Type: Journal Article
• Authors: Nguyen, Yen Ngoc; Park, Jaehoon; Bae, Sung Hwa; Kim, Dongyeon; Dang, Khanh Quoc; Son, Injoon
• Is Part Of: Materials today communications. Volume 34(2023)
• Publication Date: 2023-03
• Subjects: Bendable -- Bulk -- Bi2Te3 -- Cu-Be alloy -- Thermoelectric; Materials science -- Periodicals; 620.11
• DOI: 10.1016/j.mtcomm.2023.105408
• Languages: English
• ISSNs: 2352-4928

Abstract

Abstract: The binary Cu-Be alloy features high elasticity and yield strength. Hence, it can be used as an electrode material for bulk Bi2 Te3 -based thermoelectric (TE) devices to create bendability. First, TE materials and Cu-based electrodes were both coated with Ni/Au multilayers, which acted as diffusion barriers. Subsequently, the TE legs were connected to the Cu alloy electrode via soldering. Diffusion barriers enhanced the bonding strength and decreased the internal resistance of the TE generator. Furthermore, the internal resistance remained stable after a cyclic bending test, indicating the high flexibility of the device. The cooling performance was estimated by measuring the temperature on one side of the device while various current intensities were applied. The output power was measured using different temperature gradients and compared to the output power generated by a thermoelectric device for heat treatment. Graphical Abstract: ga1 Highlights: Cu-Be alloy electrode was used to create flexibility of bulk Bi2 Te3 thermoelectric device. Thermoelectric device maintained stable resistance after cyclic bending test. Cooling and power generating performance were validated.