A thermal management strategy for electronic devices based on copper double skin inspired hydrogel. (1st June 2023)

• Record Type: Journal Article
• Authors: Sheng, Lisha; Wang, Yi; Wang, Xin; Han, Chaoling; Chen, Zhenqian
• Is Part Of: International journal of heat and mass transfer. Volume 206(2023)
• Publication Date: 2023-06-01
• Subjects: Interpenetrating hydrogel network, Copper powder, Thermal management, Evaporative cooling -- Thermal conductivity; Heat -- Transmission -- Periodicals; Mass transfer -- Periodicals; Chaleur -- Transmission -- Périodiques; Transfert de masse -- Périodiques; Electronic journals; 621.4022
• DOI: 10.1016/j.ijheatmasstransfer.2023.123946
• Languages: English
• ISSNs: 0017-9310

Abstract

Highlights: Copper based composite hydrogels with high thermal conductivity are synthesized. Composite hydrogel have good thermal conductivity, shape stability and dispersion. The total heat dissipation of Hydrogel/Cu0.5 increases by 104.4%. Abstract: A passive cooling material was proposed by combining the advantages of an interpenetrating polymer network and copper powder. The experimental thermal conductivity of copper based composite hydrogel was enhanced to 0.71 W/(m·K). At the same time, MD simulations showed a thermal conductivity of approximately 0.84 W/(m·K), which primarily caused by the increased overlap between hydrogel components. Due to the improvement of the thermal conductivity, the heat flux of copper based composite hydrogel increased to 977 W/m 2 at a constant heat source temperature of 65 °C and the total heat dissipation increased by 104.4%. The thermal management tests showed copper based composite hydrogel could reach 35 °C, while the copper based composite hydrogel could reach 50 °C. The obtained copper based PNIPAM/Alginate-Ca 2+ hydrogel exhibited a synergistic property enhancement of high thermal conductivity, stability in shape and decreased aggregation of the copper nanoparticles, which should provide a new strategy for thermal management.