Co‐packaged datacenter optics: Opportunities and challenges. Issue 2 (22nd March 2021)

• Record Type: Journal Article
• Authors: Minkenberg, Cyriel; Krishnaswamy, Rajagopal; Zilkie, Aaron; Nelson, David
• Other Names: Pleros Nikos guestEditor.; Melloni Andrea guestEditor.; Alexoudi Theonitsa guestEditor.
• Is Part Of: IET optoelectronics. Volume 15:Issue 2(2021)
• Page Start: 77
• Page End: 91
• Publication Date: 2021-03-22
• Subjects: Optoelectronics -- Periodicals; 621.36
• DOI: 10.1049/ote2.12020
• Languages: English
• ISSNs: 1751-8768

Abstract

Abstract: High‐capacity, high‐density, power‐, and cost‐efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to adopt a new deployment model that involves co‐packaged optics? Herein, we aim to shed light on the trade‐offs involved, enabling technologies, paths to adoption, and potential impact on datacenter network architecture.