Plasmonics—high-speed photonics for co-integration with electronics. (26th April 2021)

• Record Type: Journal Article
• Authors: Koch, Ueli; Uhl, Christopher; Hettrich, Horst; Fedoryshyn, Yuriy; Moor, David; Baumann, Michael; Hoessbacher, Claudia; Heni, Wolfgang; Baeuerle, Benedikt; Bitachon, Bertold I.; Josten, Arne; Ayata, Masafumi; Xu, Huajun; Elder, Delwin L.; Dalton, Larry R.; Mentovich, Elad; Bakopoulos, Paraskevas; Lischke, Stefan; Krüger, Andreas; Zimmermann, Lars; Tsiokos, Dimitris; Pleros, Nikos; Möller, Michael; Leuthold, Juerg
• Is Part Of: Japanese journal of applied physics. Volume 60:Number SB(2021)
• Publication Date: 2021-04-26
• Subjects: Plasmonics -- Co-integration with Electronics -- Optical transmitter -- Integrated photonics; Physics -- Periodicals; 621.05
• DOI: 10.35848/1347-4065/abef13
• Languages: English
• ISSNs: 0021-4922

Abstract

Abstract: New high-speed photonic technologies and co-integration with electronics are required to keep up with the demand of future optical communication systems. In this paper, plasmonics is presented as one of the most promising next-generation photonic technologies that already fulfils these requirements in proof-of-concept demonstrations. Plasmonics features not only modulators and detectors of highest speed, but also compactness, cost- and energy-efficiency, and compatibility with CMOS electronics. Recently, co-integration with electronics was demonstrated with record performances of 222 GBd in a hybrid InP electronic-plasmonic transmitter assembly and of 120 GBd with a monolithic BiCMOS electronic-plasmonic transmitter.