Cite
HARVARD Citation
Kita, K. et al. (2023). Joining of aluminum and ceramic substrates by interposing molten aluminum–silicon alloy. International journal of applied ceramic technology. 20 (2), pp. 995-1001. [Online].
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Kita, K. et al. (2023). Joining of aluminum and ceramic substrates by interposing molten aluminum–silicon alloy. International journal of applied ceramic technology. 20 (2), pp. 995-1001. [Online].