Isotropic conductive paste for bioresorbable electronics. (February 2023)

• Record Type: Journal Article
• Authors: Kim, Kyung Su; Maeng, Woo-Youl; Kim, Seongchan; Lee, Gyubok; Hong, Minki; Kim, Ga-been; Kim, Jaewon; Kim, Sungeun; Han, Seunghun; Yoo, Jaeyoung; Lee, Hyojin; Lee, Kangwon; Koo, Jahyun
• Is Part Of: Materials today bio. Volume 18(2023)
• Publication Date: 2023-02
• Subjects: Isotropic conductive adhesive -- Conductive paste -- Implantable medical device -- Biodegradable electronics -- Screen printing; Materials science -- Periodicals; Biomedical engineering -- Periodicals; Biomedical materials -- Periodicals; 620.1
• DOI: 10.1016/j.mtbio.2023.100541
• Languages: English
• ISSNs: 2590-0064

Abstract

Abstract: Bioresorbable implantable medical devices can be employed in versatile clinical scenarios that burden patients with complications and surgical removal of conventional devices. However, a shortage of suitable electricalinterconnection materials limits the development of bioresorbable electronic systems. Therefore, this study highlights a highly conductive, naturally resorbable paste exhibiting enhanced electrical conductivity and mechanical stability that can solve the existing problems of bioresorbable interconnections. Multifaceted experiments on electrical and physical properties were used to optimize the composition of pastes containing beeswax, submicron tungstenparticles, and glycofurol. These pastes embody isotropic conductive paths for three-dimensional interconnects and function as antennas, sensors, and contact pads for bioresorbable electronic devices. The degradation behavior in aqueous solutions was used to assess its stability and ability to retain electrical conductance (∼7 ​kS/m) and structural form over the requisite dissolution period. In vitro and in vivo biocompatibility tests clarified the safety of the paste as an implantable material. Graphical abstract: Image 1