Thickness Dependence of crack initiation and propagation in stacks for piezoelectric microelectromechanical systems. (1st June 2020)
- Record Type:
- Journal Article
- Title:
- Thickness Dependence of crack initiation and propagation in stacks for piezoelectric microelectromechanical systems. (1st June 2020)
- Main Title:
- Thickness Dependence of crack initiation and propagation in stacks for piezoelectric microelectromechanical systems
- Authors:
- Coleman, Kathleen
Bermejo, Raul
Leguillon, Dominique
Trolier-McKinstry, Susan - Abstract:
- Abstract: Piezoelectric thin films are vulnerable to fracture, which results in degradation of the structural integrity and device performance in piezoelectric microelectromechanical systems (PiezoMEMS). This work explains the fracture process as a combination of a crack initiation event in the piezoelectric film followed by crack propagation through the remaining layers. Biaxial bending tests using the Ball-on-three-Balls (B3B) technique were performed on stacks containing Pb(Zr0.52 Ti0.48 )O3 (PZT) thin films of varying thicknesses grown on Si wafers (coated with thin LaNiO3 /SiO2 layers). The fracture initiates in the PZT film, arrests in the compressive SiO2 layer, prior to failure of the Si substrate. Weibull analyses show a significant effect of the thin film thickness on the stack's strength; the characteristic strength and Weibull modulus being σ 0 ∼1110 MPa and m ∼28, σ 0 ∼1060 MPa and m ∼26, and σ 0 ∼880 MPa and m ∼10 for the 0.7 µm, 1.3 µm, and 1.8 µm film stack, respectively and σ 0 ∼ 1820 MPa and m ∼3 for the Si wafer. A stress-energy criterion using finite fracture mechanics explains the dependence of crack initiation load on the PZT layer thickness, whereas linear elastic fracture mechanics is employed to rationalize crack propagation through the stack. Graphical abstract: Image, graphical abstract
- Is Part Of:
- Acta materialia. Volume 191(2020)
- Journal:
- Acta materialia
- Issue:
- Volume 191(2020)
- Issue Display:
- Volume 191, Issue 2020 (2020)
- Year:
- 2020
- Volume:
- 191
- Issue:
- 2020
- Issue Sort Value:
- 2020-0191-2020-0000
- Page Start:
- 245
- Page End:
- 252
- Publication Date:
- 2020-06-01
- Subjects:
- Piezoelectricity -- Mechanical behavior -- Microelectromechanical systems -- Thin films -- Fracture stress
Materials -- Periodicals
Materials science -- Periodicals
Materials -- Mechanical properties -- Periodicals
Metallurgy -- Periodicals
Chemistry, Inorganic -- Periodicals
620.112 - Journal URLs:
- http://www.sciencedirect.com/science/journal/13596454 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.actamat.2020.03.030 ↗
- Languages:
- English
- ISSNs:
- 1359-6454
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 0629.920000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 25493.xml