Transient Analysis Based on Finite Element Method for Ball Grid Array Package. Issue 4 (May 2021)

• Record Type: Journal Article
• Authors: Luo, Wenhao; Su, Wei; Dong, Xianshan; Nie, Zhenhua; Tomar, Agam
• Is Part Of: IOP conference series. Volume 769:Issue 4(2021)
• Publication Date: 2021-05
• Subjects: BGA -- Finite Element Simulation -- Transient -- ANASYS; Earth sciences -- Periodicals; Environmental sciences -- Congresses; Environmental sciences -- Periodicals; 550.5
• DOI: 10.1088/1755-1315/769/4/042004
• Languages: English
• ISSNs: 1755-1307

Abstract

Abstract: In this paper, finite element simulation is carried out for BGA sample. The authors establishes the model of fixture, ceramic panel and metal sheet. Based on this model, several layers papers are laid on the metal sheet for simulation test. Then, ANASYS Workbench is used to conduct transient analysis of the samples to study the influence of different thickness papers on acceleration and time. The results provide useful reference for the adjustment of dynamic response parameters.