(Invited) Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration. (24th August 2016)

• Record Type: Journal Article
• Authors: Fukushima, Takafumi; Lee, Kangwook; Tanaka, Tetsu; Koyanagi, Mitsumasa
• Is Part Of: ECS transactions. Volume 75:Number 9(2016)
• Page Start: 285
• Page End: 290
• Publication Date: 2016-08-24
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/07509.0285ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid in this decade. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configuration are introduced for fine-pitch interconnect formation. In addition, "non-transfer stacking", in other word, flip-chip self-assembly and "transfer stacking" called reconfigure-wafer-to-wafer using SAE carrier are explained.