A Novel and Robust Packaging Technology for Miniaturized FET-Based Biosensors with Microfluidic Channels. (28th April 2016)

• Record Type: Journal Article
• Authors: Hsu, Chen-Pin; Chen, Pei-Chi; Wang, Yu-Lin
• Is Part Of: ECS transactions. Volume 72:Number 6(2016)
• Page Start: 33
• Page End: 35
• Publication Date: 2016-04-28
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/07206.0033ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : FET devices are extensively used for sensors, including gas sensors and biosensors. In contrast to traditional resistive devices, FET has transconductance gain, which can significantly improve the S/N ratio. Recently, more applications in biosensors combine microfluidic channels and FET system. In FET-based biosensors, the wafer manufacturing process always requires a lot of cost, and it is used for metal lines as interconnects. Miniaturized chip plays a key role in reducing the manufacturing cost. However, simultaneously integrating the sensor and microfluidic channels on one chip is challenging. In this study, a novel and robust packaging method has been developed, to effectively reduce the size of the sensor chip and thereby the cost. 1 mm 2 FET sensor chip has been fabricated and embedded in epoxy. Photolithography and metal deposition were done followed by lift-off process for metal interconnect. The FET-embedded chip was passivated and covered by the microfluidic channel made of PMMA.