Natural convection with water-copper nanofluid around a finned vertical cylindrical electronic component. Issue 3 (18th August 2021)

• Record Type: Journal Article
• Authors: Baïri, A.; Velazquez, A.
• Is Part Of: International journal of numerical methods for heat & fluid flow. Volume 32:Issue 3(2022)
• Page Start: 931
• Page End: 943
• Publication Date: 2021-08-18
• Subjects: Free convection -- Engineering applications -- Numerical approach -- Thermal regulation -- Finned vertical cylindrical electronic component -- Water-copper nanofluid; Heat -- Transmission -- Mathematics -- Periodicals; Fluid dynamics -- Mathematics -- Periodicals; 536.2
• DOI: 10.1108/HFF-03-2021-0158
• Languages: English
• ISSNs: 0961-5539

Abstract

Abstract : Purpose: The purpose of this study is to quantify the free convective heat transfer around a vertical cylindrical electronic component equipped with vertical fins representing an antenna, contained in a closed cavity maintained isothermal. Its cooling is provided via a water-based copper nanofluid whose volume fraction varies between 0% and 10%. Its effective viscosity and thermal conductivity are determined with the Brinkman and Maxwell models. Design/methodology/approach: The governing equation system has been solved by means of the volume control method based on the SIMPLE algorithm. Findings: A Nusselt-Rayleigh correlation valid in the 3.32 × 10 5 – 6.74 × 10 7 Rayleigh number range is proposed. It allows the thermal sizing of the considered system used in high power electronics to ensure their correct operation in the worst conditions. Originality/value: The proposed correlations are original and unpublished.