Cite
HARVARD Citation
Durgam, S. et al. (2021). Thermal aspect of material selection for substrate board equipped with high heat flux IC chips. IOP conference series. 1091 (1), p. . [Online].
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Durgam, S. et al. (2021). Thermal aspect of material selection for substrate board equipped with high heat flux IC chips. IOP conference series. 1091 (1), p. . [Online].