Low‐Temperature Plasma Sintering of Inkjet‐Printed Metal Salt Decomposition Inks on Flexible Substrates. Issue 2 (6th October 2022)

• Record Type: Journal Article
• Authors: Leung, Tammy Sue-Wuen; Ramon, Eloi; Martínez-Domingo, Carme
• Is Part Of: Advanced engineering materials. Volume 25:Issue 2(2023)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2022-10-06
• Subjects: conductive inks -- flexible electronics -- inkjet printing -- low cost -- low temperature -- plasma sintering -- printed electronics; Materials -- Periodicals; 620.11
• DOI: 10.1002/adem.202200834
• Languages: English
• ISSNs: 1438-1656

Abstract

Abstract : Due to their complex formulation, conductive nanoparticle inks for inkjet printing are limited in terms of the types of metals and substrates that can be utilized. A new and simplified class of inks called metal salt decomposition (MSD) inks has the potential to introduce a multitude of metals, which can be printed directly onto a wide range of substrates. Here, the use of atmospheric oxygen plasma to develop polycrystalline Au and Pt films at processing temperatures near room temperature (≈33 °C) with excellent conductivities up to 10 5 S m −1 is demonstrated. The conformal nature of the ink allows metal films to be printed onto a broad range of temperature‐sensitive substrates including polymers, papers, and fabric. The Au ink is then used to build a simple light‐emitting diode circuit showing its flexibility, durability, and long‐term stability as deposited thin metal films. Additionally, such inks cost less than one‐third the price of similar nanoparticle inks highlighting their overall affordability and good stability. Abstract : Near‐room‐temperature processing of inkjet‐printed metal salt decomposition (MSD) inks by atmospheric oxygen plasma formed Au and Pt films with excellent conductivities (≈10 5 S m −1 ). Such inks were printed on a variety of temperature‐sensitive substrates including polymers, papers, and textiles. Their excellent conformal and adhesive properties allowed for their incorporation into electronic textiles.