Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip. (1st January 2023)

• Record Type: Journal Article
• Authors: Calderini, G.; Crescioli, F.; Dalla Betta, G.-F.; Gariano, G.; Gemme, C.; Guescini, F.; Hadzic, S.; Heim, T.; Lapertosa, A.; Ravera, S.; Rummler, A.; Samy, M.A.A.; Sultan, D.M.S.; Vannoli, L.; Ye, H.
• Is Part Of: Journal of instrumentation. Volume 18:Number 1(2023)
• Publication Date: 2023-01-01
• Subjects: Hybrid detectors -- Radiation-hard detectors -- Solid state detectors -- Detector design and construction technologies and materials; Scientific apparatus and instruments -- Periodicals; 502.84
• DOI: 10.1088/1748-0221/18/01/C01010
• Languages: English
• ISSNs: 1748-0221

Abstract

Abstract: ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25 × 100 μm 2 (barrel) or 50 × 50 μm 2 (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50 × 50 μm 2 ) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and on beam.