Cyclic Biaxial Stress Measurement Method Using the Grain Growth Direction in Electrodeposited Copper Foil. (17th May 2010)

• Record Type: Journal Article
• Authors: Ono Ono, Yuichi Yuichi; Li Li, Cheng Cheng; Hino Hino, Daisuke Daisuke
• Other Names: Rebello Rebello João Marcos A. João Marcos A. Academic Editor.
• Is Part Of: EURASIP journal on advances in signal processing. Volume 2010(2010)
• Publication Date: 2010-05-17
• Subjects: Signal processing -- Periodicals; Traitement du signal; Signal processing; Periodicals; 621.3822
• DOI: 10.1155/2010/928216
• Languages: English
• ISSNs: 1687-6172

Abstract

Abstract : A method that uses grain growth direction in electrodeposited copper foil to measure cyclic biaxial stress is examined in this paper. The grain growth direction is measured by image processing software after a cyclic loading test for various biaxial stress ratios is carried out. Since the grain growth occurs in two directions and its directions correspond closely with the direction of maximum shearing stress when the biaxial stress ratio is negative, the principal stress can be measured using Mohr's stress circle. On the other hand, when the biaxial stress ratio is positive, above-mentioned feature does not occur. Therefore, the first principal stress can be measured based on the grain growth density. The number of grains necessary to measure the biaxial stress is estimated by a statistical approach.