Cite
HARVARD Citation
Cui, J. et al. (2019). A compliant microstructured thermal interface material for dry and pluggable interfaces. International journal of heat and mass transfer. pp. 1075-1082. [Online].
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Cui, J. et al. (2019). A compliant microstructured thermal interface material for dry and pluggable interfaces. International journal of heat and mass transfer. pp. 1075-1082. [Online].