Theoretical and experimental investigations on material removal characteristics of small-diameter aspherical silicon carbide mould with weak magnetization-enhanced force-rheological polishing. (January 2023)

• Record Type: Journal Article
• Authors: Zhou, Dong-Dong; Li, Xi-Yang; Huang, Xiang-Ming; Ming, Yang
• Is Part Of: Tribology international. Volume 179(2023)
• Publication Date: 2023-01
• Subjects: Aspherical silicon carbide mould -- WMESRP -- Multi-scale MRR -- Scratch free polishing; Tribology -- Periodicals; 621.89
• DOI: 10.1016/j.triboint.2022.108106
• Languages: English
• ISSNs: 0301-679X

Abstract

Abstract: Multi-field composite polishing with non-Newtonian fluids is a potential technology for manufacturing optical moulds. However, the correlation between the micromaterial removal mechanism and the properties of magnetic shear thickening fluid (MSTF) for weak magnetization-enhanced stress-rheological polishing (WMESRP) is still unclear. In this study, we propose a weak magnetization- enhanced stress-rheological polishing (WMESRP). Based on non-Newtonian fluid dynamics, microscopic contact mechanics, and vector discrete methods, a multi-scale material removal model (MRR) was established. Under a series of fixed-point polishing experiments, the maximum change rate between the experiment and theory was obtained as less than 5.7%. In addition, comparative experiments revealed that polishing liquids containing polyethylene glycol inhibit excessive agglomeration of particle clusters, thereby achieving a smooth surface. The proposed WMESRP method can accomplish non-destructive processing of hard and brittle ceramic materials, which can be used in various applications.