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Fleischmann, M. et al. (2015). Organometallic polyphosphorus and -arsenic ligands as linkers between pre-assembled linear CuI fragments. Chemical communications. 51 (14), pp. 2893-2895. [Online].
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Fleischmann, M. et al. (2015). Organometallic polyphosphorus and -arsenic ligands as linkers between pre-assembled linear CuI fragments. Chemical communications. 51 (14), pp. 2893-2895. [Online].