Characterization and electrochemical behavior of a multilayer-structured Ti–N layer produced by plasma nitriding of electron beam melting TC4 alloy in Hank's solution. (February 2023)
- Record Type:
- Journal Article
- Title:
- Characterization and electrochemical behavior of a multilayer-structured Ti–N layer produced by plasma nitriding of electron beam melting TC4 alloy in Hank's solution. (February 2023)
- Main Title:
- Characterization and electrochemical behavior of a multilayer-structured Ti–N layer produced by plasma nitriding of electron beam melting TC4 alloy in Hank's solution
- Authors:
- Li, Yang
Wang, Zhengwei
Shao, Minghao
Zhang, Zhehao
Wang, Chengxu
Yan, Jiwen
Lu, Jinpeng
Zhang, Lei
Xie, Bing
He, Yongyong
Qiu, J.X. - Abstract:
- Abstract: In this work, electron beam melting (EBM) titanium alloy were strengthened by carrying out a hollow cathodic plasma source nitriding treatment. The EBM-TC4 alloys were nitrided at 500 °C for 1, 3, and 5 h in an NH3 atmosphere. X-ray diffraction, scanning electron microscopy, high-resolution transmission electron microscopy, atomic force microscopy, and X-ray photoelectron spectroscopy was used to evaluate the microstructure and surface morphology of the samples. The nitrided layers formed on the EBM-TC4 alloy were identified as TiN, Ti2 N, and nitrogen-stabilized α(N)–Ti phases. Potentiodynamic polarization and electrochemical impedance spectroscopy measurements were carried out to evaluate the electrochemical behavior of the samples in Hank's balanced salt solution. The relationship between the corrosion resistance of the nitrided layer and its microstructure was explored. Thus, the improved properties of the nitrided alloys can be attributed to the formation of a Ti–N layer composed of an outermost nanocrystalline/amorphous TiN layer and a crystalline TiN sub-layer on the top of the Ti2 N crystal layer. The novel Ti–N layer structure with improved corrosion resistance provides broad opportunities for the application of commercial Ti alloys and improving their durability. Highlights: HCPSN was used to fabricate a nitrided layer on an EBM-TC4 alloy. A compound layer composed of an outermost nanocrystalline/amorphous TiN layer and a crystalline TiN sub-layer and onAbstract: In this work, electron beam melting (EBM) titanium alloy were strengthened by carrying out a hollow cathodic plasma source nitriding treatment. The EBM-TC4 alloys were nitrided at 500 °C for 1, 3, and 5 h in an NH3 atmosphere. X-ray diffraction, scanning electron microscopy, high-resolution transmission electron microscopy, atomic force microscopy, and X-ray photoelectron spectroscopy was used to evaluate the microstructure and surface morphology of the samples. The nitrided layers formed on the EBM-TC4 alloy were identified as TiN, Ti2 N, and nitrogen-stabilized α(N)–Ti phases. Potentiodynamic polarization and electrochemical impedance spectroscopy measurements were carried out to evaluate the electrochemical behavior of the samples in Hank's balanced salt solution. The relationship between the corrosion resistance of the nitrided layer and its microstructure was explored. Thus, the improved properties of the nitrided alloys can be attributed to the formation of a Ti–N layer composed of an outermost nanocrystalline/amorphous TiN layer and a crystalline TiN sub-layer on the top of the Ti2 N crystal layer. The novel Ti–N layer structure with improved corrosion resistance provides broad opportunities for the application of commercial Ti alloys and improving their durability. Highlights: HCPSN was used to fabricate a nitrided layer on an EBM-TC4 alloy. A compound layer composed of an outermost nanocrystalline/amorphous TiN layer and a crystalline TiN sub-layer and on the top of the Ti2 N crystal layer. The nitrided layer remarkably improved the corrosion resistance of the EBM-TC4 alloy in Hank's balanced salt solution. This can be attributed to the formation of a protective multilayer-structured Ti–N layer and its appropriate roughness. … (more)
- Is Part Of:
- Vacuum. Volume 208(2023)
- Journal:
- Vacuum
- Issue:
- Volume 208(2023)
- Issue Display:
- Volume 208, Issue 2023 (2023)
- Year:
- 2023
- Volume:
- 208
- Issue:
- 2023
- Issue Sort Value:
- 2023-0208-2023-0000
- Page Start:
- Page End:
- Publication Date:
- 2023-02
- Subjects:
- Electron beam melting -- TC4 alloy -- Plasma nitriding -- TEM -- AFM -- Electrochemical impedance spectroscopy
Vacuum -- Periodicals
621.55 - Journal URLs:
- http://www.elsevier.com/journals ↗
http://www.sciencedirect.com/science/journal/0042207X ↗ - DOI:
- 10.1016/j.vacuum.2022.111737 ↗
- Languages:
- English
- ISSNs:
- 0042-207X
- Deposit Type:
- Legaldeposit
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- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 9139.000000
British Library DSC - BLDSS-3PM
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