The Simulation Analysis of IGBT Module Based on COMSOL. Issue 1 (1st November 2022)

• Record Type: Journal Article
• Authors: Qiu, Guoqing; Wang, Wei; Xu, Shengyou; Yang, Xin; Jiang, Kedi
• Is Part Of: Journal of physics. Volume 2306:Issue 1(2022)
• Publication Date: 2022-11-01
• Subjects: Physics -- Congresses; 530.5
• DOI: 10.1088/1742-6596/2306/1/012001
• Languages: English
• ISSNs: 1742-6588

Abstract

Abstract: IGBT, as the core device of high-capacity power electronic equipment, its stability is directly relevant to the normal operation of the equipment. It would cause system failure and major security incidents if aging failure phenomenon occurs. A complex multi-physical field coupling process is involved in the aging failure of IGBT. Based on Comsol software, this paper conducts a series of simulations on IGBT module model SKM50GB12T4, and also improves the simulation of the solder layer voids by combining with related literature on materials science to provide a basis for subsequent research on IGBT.