Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallization. Issue 12 (7th October 2022)

• Record Type: Journal Article
• Authors: Ryspayeva, Assel; Zhakeyev, Adilet; Desmulliez, Marc P. Y.; Marques-Hueso, Jose
• Is Part Of: Advanced engineering materials. Volume 24:Issue 12(2022)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2022-10-07
• Subjects: circuitry -- multimaterials -- photopolymers -- plating -- selective metallization -- 3D printing; Materials -- Periodicals; 620.11
• DOI: 10.1002/adem.202201243
• Languages: English
• ISSNs: 1438-1656

Abstract

Abstract : Herein, a 3D printing technique to enable the manufacturing of selectively plated polymer objects by photopolymer printing and copper metallization is presented. Metallized plastic has become popular in a number of industries due to its lightweight, flexibility of design, and cost‐effective fabrication. Common metallization techniques require multiple pretreatment steps, such as surface etching, sensitization/activation, and acceleration. The proposed method, by eliminating the sensitization step, allows selective metallization of 3D‐printed samples by direct plating. The method relies on the inclusion of silver seeds into a mixture of acrylate‐ and methacrylate‐based monomers and oligomers, which enables direct electroless copper metallization following 3D printing. Ag(I) ions act as catalytic sites for copper deposition. Copper films grown with embedded 2 and 4 wt% Ag(I) seeds reach thicknesses of 5.7 ± 1.2 and 7.7 ± 1.3 μm, respectively. Furthermore, printing with pristine and silver‐modified resins on the same sample allows selective plating: only the modified resin is plated leaving the pristine resin unaffected. A proof‐of‐concept temperature sensor is manufactured to demonstrate the performance of the printed interconnects. Abstract : Multimaterial integration in photopolymer 3D printing is achieved with a modified resin that allows selective metallization after 3D printing, thanks to the inclusion of silver seeds into an acrylate/methacrylate resin, which enables direct electroless copper plating. Printing with pristine and silver‐modified resins on the same sample allows selective plating, which can be used for 3D circuits and electronic devices.