Promising Electrode and Electrolyte Materials for High‐Energy‐Density Thin‐Film Lithium Batteries. Issue 1 (9th July 2021)

• Record Type: Journal Article
• Authors: Lin, Jie; Lin, Liang; Qu, Shasha; Deng, Dongyuan; Wu, Yunfan; Yan, Xiaolin; Xie, Qingshui; Wang, Laisen; Peng, Dongliang
• Is Part Of: Energy & environmental materials. Volume 5:Issue 1(2022)
• Page Start: 133
• Page End: 156
• Publication Date: 2021-07-09
• Subjects: all‐solid‐state -- high‐energy‐density -- lithium battery -- physical vapor deposition -- thin film; Power resources -- Environmental aspects -- Periodicals; Renewable energy sources -- Periodicals; Environmental engineering -- Periodicals; 333.79
• DOI: 10.1002/eem2.12202
• Languages: English
• ISSNs: 2575-0356

Abstract

Abstract : All‐solid‐state thin‐film lithium batteries (TFLBs) are the ideal wireless power sources for on‐chip micro/nanodevices due to the significant advantages of safety, portability, and integration. As the bottleneck for increasing the energy density of TFLBs, the key components of cathode, electrolyte, and anode are still underway to be improved. In this review, a brief history of TFLBs is first outlined by presenting several TFLB configurations. Based on the state‐of‐the‐art materials developed for lithium‐ion batteries (LIBs), the challenges and related strategies for the application of those potential electrode and electrolyte materials in TFLBs are discussed. Given the advanced manufacture and characterization techniques, the recent advances of TFLBs are reviewed for pursuing the high‐energy‐density and long‐term‐durability demands, which could guide the development of future TFLBs and analogous all‐solid‐state lithium batteries. Abstract : Based on the state‐of‐the‐art electrode and electrolyte materials developed for lithium‐ion batteries, this review highlights the potential application of those high‐performance materials in thin‐film lithium batteries and discusses the main challenges and solutions to fulfill the high‐energy‐density and long‐term‐cycling demands of future on‐chip power sources.