A critical review of copper electroless deposition on glass substrates for microsystems packaging applications. (3rd June 2022)

• Record Type: Journal Article
• Authors: Pawar, Karan; Dixit, Pradeep
• Is Part Of: Surface engineering. Volume 38:Number 6(2022)
• Page Start: 576
• Page End: 617
• Publication Date: 2022-06-03
• Subjects: Electroless -- copper -- glass -- adhesion -- roughening -- abrasive -- annealing -- peel-test; Surfaces (Technology) -- Periodicals; Coatings -- Periodicals; 620.4405
• DOI: 10.1080/02670844.2022.2142002
• Languages: English
• ISSNs: 0267-0844

Abstract

ABSTRACT: This article reviews the state-of-the-art electroless copper deposition on glass substrates and the associated challenges.The well-known issue of poor adhesion of electroless copper with the glass substrate was addressed and later, improved bymodifying the surface energy using a specific chemical treatment or by creating localized surface roughening. Localized surfaceregions in the glass were created by abrasive-based ultrasonic machining and high-temperature electrochemical-discharge machiningtechniques. The effect of critical process parameters on the surface roughness and morphology was explained. Both qualitative andquantitative adhesion measurement techniques, such as cross-hatch tests and 90°/180° peel adhesion tests, were presented. Theadhesion strength is affected by the surface roughness of the substrate and residual stress build-up in the film. As the build-up stresscan be released by the post-deposition annealing, the adhesion strength is further increased. Finally, the electroless coppertechnology in making through-glass-vias and embedded redistribution lines are presented.