Hierarchically Interlaced 2D Copper Iodide/MXene Composite for High Thermoelectric Performance. Issue 1 (31st October 2021)

• Record Type: Journal Article
• Authors: Karthikeyan, Vaithinathan; Theja, Vaskuri C. S.; De Souza, Maria Merlyne; Roy, Vellaisamy A. L.
• Is Part Of: Physica status solidi. Volume 16:Issue 1(2022)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2021-10-31
• Subjects: copper iodide -- layered hierarchies -- MXenes -- nanoinclusions -- thermoelectrics; Solid state physics -- Periodicals; 530.4105
• DOI: 10.1002/pssr.202100419
• Languages: English
• ISSNs: 1862-6254

Abstract

Abstract : A hierarchical layered architecture in thermoelectric materials works as an ad hoc methodology for strengthening the unique inherent properties. Herein, an excellent thermoelectric behavior in novel 2D copper iodide nanoflakes is demonstrated by compositing with Ti3 C2 MXene nanoinclusions. The interlaced architecture of the CuI/Ti3 C2 composite lifts the electrical conductivity over two orders by efficient charge transport mechanisms. The thermal conductivity of CuI/Ti3 C2 composite is reduced by drastic suppression of mid‐ and high‐frequency phonons by interfacial energy barrier scattering. The structural engineering approach yields a massive power factor of 225 μW m −1 K −2 and a figure of merit value of 0.48 in CuI/5 vol% Ti3 C2 composite. A straightforward approach of tuning the figure of merit in Earth‐abundant, nontoxic thermoelectric materials to develop future sustainable energy sources is established. Abstract : Layered 2D thermoelectric materials are known for their exceptional electrical and thermal properties. Hierarchical structuring of these novel 2D materials enhances the thermoelectric properties by steadily tuning the electron and phonon transport characteristics in the material. In this work, the phenomenon of interfacial energy barrier scattering in the hierarchically interlaced structure of copper iodide with Mxene for enhanced thermoelectric performance is demonstrated.