Preparation of degradable bio-based silicone/epoxy hybrid resins towards low dielectric composites. (5th December 2022)
- Record Type:
- Journal Article
- Title:
- Preparation of degradable bio-based silicone/epoxy hybrid resins towards low dielectric composites. (5th December 2022)
- Main Title:
- Preparation of degradable bio-based silicone/epoxy hybrid resins towards low dielectric composites
- Authors:
- Zhang, Pengbo
Long, Jun
Xue, Kangle
Liu, Hailong
Song, ZiDie
Liu, Ming
Yao, Tongjie
Liu, Li - Abstract:
- Graphical abstract: Highlights: D k of PMEP- x -MHHPA is lower than PMEP- x -DDM due to polar hydroxyl groups in latter. D k of QF/PMEP-0.8-MHHPA was 2.5 at a frequency of 10 MHz, lower than commercial DGEBA. Compared to QF/DGEBA-MHHPA, impact strength of QF/PMEP-0.8-MHHPA largely increases. All hybrid resins can be totally degraded in 3 days under alkaline condition at 80 ℃. Soybeans are cultivated in dialysis solution after degradation due to low toxicity. Abstract: Epoxy resins are well-known adhesive materials, however, the high dielectric constant ( D k ) limited their application in microelectronic devices. Additionally, non-degradability is a bottleneck for all thermosetting resins, and the discarded resins posed the great threat to environment. Herein, a bio-based eugenol epoxy was grafted onto the polymethylhydrosiloxane (PMHS- x ) main chain via a hydrosilylation reaction to simultaneously lower the D k and enable degradability. The curing kinetics of bio-based silicone/epoxy hybrid resins with methyl hexahydrophthalic anhydride (MHHPA) or 4, 4′-diaminodiphenylmethane (DDM) were studied. The cured resins exhibited low D k and hydrophobicity by taking advantage of the low polarity, large molecular volume and high dissociation energy of the siloxane segments. The polysiloxane degradation process took place under alkaline conditions, allowing the retrieval of reinforced fibers from the composites. To better illustrate the superiority of the bio-based silicone/epoxyGraphical abstract: Highlights: D k of PMEP- x -MHHPA is lower than PMEP- x -DDM due to polar hydroxyl groups in latter. D k of QF/PMEP-0.8-MHHPA was 2.5 at a frequency of 10 MHz, lower than commercial DGEBA. Compared to QF/DGEBA-MHHPA, impact strength of QF/PMEP-0.8-MHHPA largely increases. All hybrid resins can be totally degraded in 3 days under alkaline condition at 80 ℃. Soybeans are cultivated in dialysis solution after degradation due to low toxicity. Abstract: Epoxy resins are well-known adhesive materials, however, the high dielectric constant ( D k ) limited their application in microelectronic devices. Additionally, non-degradability is a bottleneck for all thermosetting resins, and the discarded resins posed the great threat to environment. Herein, a bio-based eugenol epoxy was grafted onto the polymethylhydrosiloxane (PMHS- x ) main chain via a hydrosilylation reaction to simultaneously lower the D k and enable degradability. The curing kinetics of bio-based silicone/epoxy hybrid resins with methyl hexahydrophthalic anhydride (MHHPA) or 4, 4′-diaminodiphenylmethane (DDM) were studied. The cured resins exhibited low D k and hydrophobicity by taking advantage of the low polarity, large molecular volume and high dissociation energy of the siloxane segments. The polysiloxane degradation process took place under alkaline conditions, allowing the retrieval of reinforced fibers from the composites. To better illustrate the superiority of the bio-based silicone/epoxy hybrid resins, quartz fiber reinforced composites were prepared. Compared to the commercial epoxy based composite, the impact strength of the PMHS- x with a silicon hydrogen content of 0.8 × 10 -2 mol·g −1 was increased by 26.5 %, meanwhile, the D k was decreased by 16.7 %. The bio-based silicone/epoxy hybrid resins not only alleviated the environmental pollution but also provided a reliable approach for fiber recycling from epoxy composites. The low polarity and degradability were integrated into bio-based silicone/epoxy hybrid resins, which provided a novel way to prepare environment-friendly materials suitable for microelectronic devices. … (more)
- Is Part Of:
- European polymer journal. Volume 181(2022)
- Journal:
- European polymer journal
- Issue:
- Volume 181(2022)
- Issue Display:
- Volume 181, Issue 2022 (2022)
- Year:
- 2022
- Volume:
- 181
- Issue:
- 2022
- Issue Sort Value:
- 2022-0181-2022-0000
- Page Start:
- Page End:
- Publication Date:
- 2022-12-05
- Subjects:
- Degradable bio-based silicone/epoxy hybrid resins -- Hydrophobicity -- Low Dielectric constant -- Non-isothermal curing kinetics
Polymers -- Periodicals
Polymerization -- Periodicals
Polymères -- Périodiques
Polymérisation -- Périodiques
Polymerization
Polymers
Periodicals
Electronic journals
547.705 - Journal URLs:
- http://www.sciencedirect.com/science/journal/00143057 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.eurpolymj.2022.111691 ↗
- Languages:
- English
- ISSNs:
- 0014-3057
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 3829.791000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 24456.xml