Cite
HARVARD Citation
Borzì, A. et al. (2022). HRXRD and micro-CT multiscale investigation of stress and defects induced by a novel packaging design for MEMS sensors. Applied materials today. p. . [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Borzì, A. et al. (2022). HRXRD and micro-CT multiscale investigation of stress and defects induced by a novel packaging design for MEMS sensors. Applied materials today. p. . [Online].