Cite
HARVARD Citation
Liu, D. et al. (2022). Atomic-level flatness on oxygen-free copper surface in lapping and chemical mechanical polishing. Nanoscale advances. 4 (20), pp. 4263-4271. [Online].
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Liu, D. et al. (2022). Atomic-level flatness on oxygen-free copper surface in lapping and chemical mechanical polishing. Nanoscale advances. 4 (20), pp. 4263-4271. [Online].