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HARVARD Citation
Li, M. et al. (2022). Ultrathin diamond blades for dicing single crystal SiC developed using a novel bonding method. Journal of manufacturing processes. pp. 88-99. [Online].
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Li, M. et al. (2022). Ultrathin diamond blades for dicing single crystal SiC developed using a novel bonding method. Journal of manufacturing processes. pp. 88-99. [Online].