An efficient thermal interface material with anisotropy orientation and high through-plane thermal conductivity. (5th January 2023)
- Record Type:
- Journal Article
- Title:
- An efficient thermal interface material with anisotropy orientation and high through-plane thermal conductivity. (5th January 2023)
- Main Title:
- An efficient thermal interface material with anisotropy orientation and high through-plane thermal conductivity
- Authors:
- Zhang, Guorui
Xue, Sen
Chen, Feng
Fu, Qiang - Abstract:
- Abstract: The rapid development of integrated circuits and electronic devices with increased power density and heat flux, requires effective heat dissipation for thermal management. Constructing a directional thermal pathway from the vertically aligned thermal conductive fillers in the thickness-direction of polymer-based thermal interface materials (TIMs) is a desirable strategy to form materials with high thermal conductivity. However, due to the complexity of vertical orientation technology, fillers with the poor orientation degree weaken the enhancement of through-plane thermal conductivity. In this work, we prepared short carbon fiber (CF)/olefin block copolymer (OBC) composites with high orientation degree via the melting extrusion method on a basis of sharing force induce alignment. Attributed to the high orientation degree of CF in the vertical direction, the as-prepared material shows a through-plane thermal conductivity (κ⊥ ) up to 15.06 W/m K at a 30 vol% CF content, which is ∼10 times that of a parallel structure. The operating temperature difference between vertical and random reached 35.2 °C, surpassing the characters in most works of literature. This study provides an effective way to develop high-oriented degree and electrical insulation polymer composites with superior κ⊥ for scalable thermal management applications in electronic devices. Graphical abstract: Image 1 Highlights: A facile and efficient method to obtain high orientation for polymer-based TIMs.Abstract: The rapid development of integrated circuits and electronic devices with increased power density and heat flux, requires effective heat dissipation for thermal management. Constructing a directional thermal pathway from the vertically aligned thermal conductive fillers in the thickness-direction of polymer-based thermal interface materials (TIMs) is a desirable strategy to form materials with high thermal conductivity. However, due to the complexity of vertical orientation technology, fillers with the poor orientation degree weaken the enhancement of through-plane thermal conductivity. In this work, we prepared short carbon fiber (CF)/olefin block copolymer (OBC) composites with high orientation degree via the melting extrusion method on a basis of sharing force induce alignment. Attributed to the high orientation degree of CF in the vertical direction, the as-prepared material shows a through-plane thermal conductivity (κ⊥ ) up to 15.06 W/m K at a 30 vol% CF content, which is ∼10 times that of a parallel structure. The operating temperature difference between vertical and random reached 35.2 °C, surpassing the characters in most works of literature. This study provides an effective way to develop high-oriented degree and electrical insulation polymer composites with superior κ⊥ for scalable thermal management applications in electronic devices. Graphical abstract: Image 1 Highlights: A facile and efficient method to obtain high orientation for polymer-based TIMs. Excellent through-plane thermal conductivity is obtained via constructing vertical structure. Outstanding thermal management capability is achieved as an efficient TIM. … (more)
- Is Part Of:
- Composites science and technology. Volume 231(2023)
- Journal:
- Composites science and technology
- Issue:
- Volume 231(2023)
- Issue Display:
- Volume 231, Issue 2023 (2023)
- Year:
- 2023
- Volume:
- 231
- Issue:
- 2023
- Issue Sort Value:
- 2023-0231-2023-0000
- Page Start:
- Page End:
- Publication Date:
- 2023-01-05
- Subjects:
- Carbon fiber -- Vertical alignment -- Anisotropy -- Through-plane thermal conductivity -- Thermal interface materials
Composite materials -- Periodicals
Composite materials
Fibrous composites
Periodicals
620.118 - Journal URLs:
- http://www.sciencedirect.com/science/journal/02663538 ↗
http://www.elsevier.com/journals ↗ - DOI:
- 10.1016/j.compscitech.2022.109784 ↗
- Languages:
- English
- ISSNs:
- 0266-3538
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 3365.650000
British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 24320.xml