Cite
HARVARD Citation
Zhang, Y. et al. (2022). Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests. Microelectronics and reliability. p. . [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Zhang, Y. et al. (2022). Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests. Microelectronics and reliability. p. . [Online].