Cite
HARVARD Citation
Wang, J. et al. (2022). Enhanced Heat Transport Capability across Boron Nitride/Copper Interface through Inelastic Phonon Scattering. Advanced functional materials. p. n/a. [Online].
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Wang, J. et al. (2022). Enhanced Heat Transport Capability across Boron Nitride/Copper Interface through Inelastic Phonon Scattering. Advanced functional materials. p. n/a. [Online].