Stable Ultrathin Perovskite/Polyvinylidene Fluoride Composite Films for Imperceptible Multi‐Color Fluorescent Anti‐Counterfeiting Labels. Issue 10 (24th June 2021)

• Record Type: Journal Article
• Authors: Sun, Junlu; Hua, Qilin; Zhao, Mengqi; Dong, Lin; Chang, Yu; Wu, Wenqiang; Li, Jing; Chen, Qiushuo; Xi, Jianguo; Hu, Weiguo; Pan, Caofeng; Shan, Chongxin
• Is Part Of: Advanced materials technologies. Volume 6:Issue 10(2021)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2021-06-24
• Subjects: anti‐counterfeiting -- fluorescent labels -- multi‐color -- stable -- ultrathin; Materials science -- Periodicals; Technological innovations -- Periodicals; Materials science; Technological innovations; Periodicals; 620.1105
• DOI: 10.1002/admt.202100229
• Languages: English
• ISSNs: 2365-709X

Abstract

Abstract: As an essential part of information security in the Internet of Things (IoT), fluorescent labels possess a principal portion of anti‐counterfeiting due to its easy fabrication, low cost, and high yield. Here an ultrathin, stable, and patterned multi‐color fluorescent label with perovskite/polyvinylidene fluoride composite film is presented, which registers a resolution of 56.4 dpi and almost maintains its original fluorescent intensity after being immersed in water for 120 h. The variable color of fluorescent labels will improve the anti‐counterfeiting dimensions for the information security due to precise halogen constitutions. The imperceptible fluorescent labels are typically with a thickness of 1.2 um and a weight of 1.2 mg. They can be conformally adhered on the arbitrary curved substrate as the intelligent multi‐color fluorescent anti‐counterfeiting labels for IoT applications. Abstract : Ultrathin, stable, and patterned multi‐color fluorescent labels with perovskite/polyvinylidene fluoride composite films possess a resolution of 56.4 dpi and excellent stability in water for 120 h. The imperceptible fluorescent labels with a thickness of 1.2 um and a weight of 1.2 mg can be conformally adhered on the arbitrary curved substrate to be applied in Internet of Things applications.