Cite
HARVARD Citation
He, H. et al. (2022). Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging. Advanced materials. 34 (38), p. n/a. [Online].
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He, H. et al. (2022). Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging. Advanced materials. 34 (38), p. n/a. [Online].